GB/T 28277-2012
ActiveSilicon-based MEMS fabrication technology - Measurement method of cutting and pull-press strength of micro bonding area
硅基MEMS制造技术 微键合区剪切和拉压强度检测方法
🔗 Related Standards / 同类标准
GB/Z 43510-2023
Integrated circuit TSV 3D package reliability test methods guideline
GB/T 4855-1984
Families and products of linear amplifier for semiconductor integrated circuits
GB/T 3434-1986
Families and products of ECL circuits for semiconductor integrated circuits
GB/T 3431.2-1986
Letter symbols for semiconductor integrated circuits--Letter symbols for function of pins
GB/T 6648-1986
Blank detail specification for semiconductor inte-grated circuit static read/write memories
GB/T 6814-1986
Families and variety ofsemiconductor integrated non-linear circuits--Variety of analog switch
GB/T 6813-1986
Families and variety ofsemiconductor integrated non-linear circuits--Variety of timers
GB/T 6815-1986
Families and variety of semiconductor integrated non-linear circuits--Variety of phase-locked loop