GB/T 15879.604-2023

Active

Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA)

半导体器件的机械标准化第6-4部分：表面安装半导体器件封装外形图绘制的一般规则焊球阵列（BGA）封装的尺寸测量方法

Standard Type

GBT

ICS

31.200

CCS

L55

Status

现行

Issue Date

2023-05-23

Implementation

2023-09-01

Responsible Dept

工业和信息化部（电子）

Drafting Unit

N/A

🔗 Related Standards / 同类标准

GB/Z 43510-2023 Integrated circuit TSV 3D package reliability test methods guideline GB/T 4855-1984 Families and products of linear amplifier for semiconductor integrated circuits GB/T 3434-1986 Families and products of ECL circuits for semiconductor integrated circuits GB/T 3431.2-1986 Letter symbols for semiconductor integrated circuits--Letter symbols for function of pins GB/T 6648-1986 Blank detail specification for semiconductor inte-grated circuit static read/write memories GB/T 6814-1986 Families and variety ofsemiconductor integrated non-linear circuits--Variety of analog switch GB/T 6813-1986 Families and variety ofsemiconductor integrated non-linear circuits--Variety of timers GB/T 6815-1986 Families and variety of semiconductor integrated non-linear circuits--Variety of phase-locked loop