Browse Standards

集成电路 电磁发射测量 第2部分：辐射发射测量 TEM小室和宽带TEM小室法

Integrated circuits—Measurement of electromagnetic emissions—Part 2: Measurement of radiated emissions—TEM cell and wideband TEM cell method

集成电路 电磁发射测量 第1部分: 通用条件和定义

Integrated circuits—Measurement of electromagnetic emissions—Part 1: General conditions and definitions

半导体器件 机械和气候试验方法 第8部分：密封

Semiconductor devices—Mechanical and climatic test methods—Part 8：Sealing

电子设备用固定电容器 第23部分：分规范 表面安装金属化聚萘二甲酸乙二醇酯膜介质直流固定电容器

Fixed capacitors for use in electronic equipment—Part 23:Sectional specification—Fixed metallized polyethylene naphthalate film dielectric surface mount DC capacitors

半导体器件的机械标准化 第6-12部分：表面安装半导体器件封装外形图绘制的一般规则 密节距焊盘阵列封装（FLGA）的设计指南

Mechanical standardization of semiconductor devices—Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Design guidelines for fine-pitch land grid array (FLGA)

半导体器件 机械和气候试验方法 第39部分：半导体器件用有机材料的潮气扩散率和水溶解度测量

Semiconductor devices—Mechanical and climatic test methods—Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

人造石英晶体 规范与使用指南

Synthetic quartz crystal—Specifications and guidelines for use

有质量评定的声表面波滤波器 第2部分：使用指南

Surface acoustic wave (SAW) filters of assessed quality—Part 2: Guidelines for the use

集成电路电磁兼容建模 第2部分：集成电路电磁干扰特性仿真模型 传导发射建模（ICEM-CE）

EMC IC modelling—Part 2: Models of integrated circuits for EMI behavioural simulation—Conducted emissions modelling (ICEM-CE)

石英晶体元件参数的测量 第8部分：表面贴装石英晶体元件用测量夹具

Measurement of quartz crystal unit parameters—Part 8: Test fixture for surface mounted quartz crystal units

表面安装技术 第4部分：湿敏器件的处理、标记、包装和分类

Surface mounting technology—Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

嵌入式基板测试方法

Test methods for device embedded substrate

高亮度LED用印制板热导率测试方法

Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs

质量评定体系 第3部分：印制板及层压板最终产品检验及过程监督用抽样方案的选择和使用

Quality assessment systems—Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing

集成电路电磁兼容建模 第3部分：集成电路电磁干扰特性仿真模型 辐射发射建模（ICEM-RE）

EMC IC modelling—Part 3: Models of integrated circuits for EMI behavioural simulation—Radiated emissions modelling (ICEM-RE)

半导体器件 机械和气候试验方法 第40部分：采用应变仪的板级跌落试验方法

Semiconductor devices—Mechanical and climatic test methods—Part 40: Board level drop test method using a strain gauge

电子设备用固定电容器 第14-1部分：空白详细规范 抑制电源电磁干扰用固定电容器 评定水平DZ

Fixed capacitors for use in electronic equipment—Part 14-1: Blank detail specification—Fixed capacitors for electromagnetic interference suppression and connection to the supply mains—Assessment level DZ

激光产品的安全 第12部分：用于信息传输的自由空间光通信系统的安全

Safety of laser products—Part 12: Safety of free space optical communication systems used for transmission of information

电力系统用串联电容器 第3部分：内部熔丝

Series capacitors for power systems—Part 3：Internal fuses

电力系统用串联电容器 第1部分：总则

Series capacitors for power systems—Part 1:General