GB/T 15879.612-2025

Upcoming

Mechanical standardization of semiconductor devices—Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Design guidelines for fine-pitch land grid array (FLGA)

半导体器件的机械标准化第6-12部分：表面安装半导体器件封装外形图绘制的一般规则密节距焊盘阵列封装（FLGA）的设计指南

Standard Type

GBT

ICS

31.080.01

CCS

L55

Status

即将实施

Issue Date

2025-12-31

Implementation

2026-07-01

Responsible Dept

工业和信息化部（电子）

Drafting Unit

N/A

🔗 Related Standards / 同类标准

GB/Z 107-2025 Semiconductor devices—Scan based ageing level estimation for semiconductor devices GB/Z 102.17-2026 Semiconductor devices—Discrete devices—Part 17: Magnetic and capacitive coupler for basic and reinforced insulation GB/T 6256-1986 Blank detail specification forindustrial heating triodes GB/T 7581-1987 Dimensions of outlines for semiconductor discrete devices GB/T 9432-1988 Blank detail specification for industrial heating tetrode GB/T 249-1989 The rule of type designation for discrete semiconductor devices GB/T 12300-1990 Test methods of safe operating area for power transistors GB/T 12847-1991 Blank detail specification for hydrogen thyratrons