Browse Standards
1450+ standards in database
1450 result(s) found
印制电路板材料 第5-4部分： 涂覆或非涂覆的导电箔和膜分规范 导电浆料
Printed circuit board materials—Part 5-4:Sectional specification set for conductive foils and films with or without coatings—Conductive pastes
电子和电气设备用连接器 产品要求 第8-100部分：电源连接器 2芯、3芯20 A功率加2芯信号塑料外壳屏蔽密封连接器详细规范
Connectors for electrical and electronic equipment—Product requirements—Part 8-100: Power connectors—Detail specification for 2-pole or 3-pole power plus 2-pole signal shielded and sealed connectors with plastic housing for rated current of 20 A
电子和电气设备用连接器 产品要求 第8-101部分：电源连接器 2芯、3芯40 A功率加2芯信号塑料外壳屏蔽密封连接器详细规范
Connectors for electrical and electronic equipment—Product requirements—Part 8-101: Power connectors—Detail specification for 2-pole or 3-pole power plus 2-pole signal shielded and sealed connectors with plastic housing for rated current of 40 A
电子装联技术 电子模块
Electronics assembly technology—Electronic modules
半导体器件 金属氧化物半导体场效应晶体管（MOSFETs）的偏置温度不稳定性试验
Semiconductor devices—Bias temperature instability test for metal-oxide semiconductor field-effect transistors (MOSFETs)
半导体器件 栅介质层的时间相关介电击穿（TDDB）试验
Semiconductor devices—Time dependent dielectric breakdown (TDDB) test for gate dielectric films
半导体器件 恒流电迁移试验
Semiconductor devices—Constant current electromigration test
半导体器件 金属氧化物半导体（MOS） 晶体管的热载流子试验
Semiconductor devices—Hot carrier test on metal-oxide semiconductor(MOS) transistors
半导体器件 内部金属层间的时间相关介电击穿（TDDB）试验
Semiconductor devices—Time dependent dielectric breakdown (TDDB) test for inter-metal layers
半导体器件 应力迁移试验 第1部分：铜应力迁移试验
Semiconductor devices—Stress migration test—Part 1: Copper stress migration test
激光材料中激活离子浓度测试方法
Test methods for active ion concentration in laser material
有机发光二极管显示器件 第6-2部分：测试方法 视觉质量和亮室性能
Organic light emitting diode displays—Part 6-2: Test methods—Visual quality and ambient performance
电子装联技术 第4部分：阵列型封装表面安装器件焊点的耐久性试验方法
Electronics assembly technology—Part 4: Endurance test methods for solder joint of area array type package surface mount devices
质量评定体系 第2部分：电子元器件及封装件检验用抽样方案的选择和使用
Quality assessment systems —Part 2: Selection and use of sampling plans for inspection of electronic components and packages
印制电路板测试方法 温度循环状态下镀覆孔单孔电阻的变化
Test method for printed board—Monitoring of single plated-through hole(PTH) resistance change during temperature cycling
氯化钠光学元件
Sodium chloride optical components
激光产品的安全 第14部分：用户指南
Safety of laser products—Part 14: A user's guide
印制板用光成像耐电镀抗蚀剂
Photoimageable plating and etching resist for printed circuit board
激光产品的安全 第8部分：作用于人的激光安全使用指南
Safety of laser products—Part 8: Guidelines for the safe use of lasers on humans
平板显示器基板玻璃规范
Specification for flat panel display glass substrates