GB/T 45713.4-2025

Active

Electronics assembly technology—Part 4: Endurance test methods for solder joint of area array type package surface mount devices

电子装联技术第4部分：阵列型封装表面安装器件焊点的耐久性试验方法

Standard Type

GBT

ICS

31.180

CCS

L30

Status

现行

Issue Date

2025-05-30

Implementation

2025-09-01

Responsible Dept

工业和信息化部（电子）

Drafting Unit

N/A

🔗 Related Standards / 同类标准

GB/T 5489-1985 Printed board drawing GB/T 9315-1988 Series for printed boards outside dimension GB/T 12559-1990 The patternes series for artwork master of printed circuits GB/T 12630-1990 Thin epoxide woven glass fabric copper-clad laminated sheet， general purpose grade， for use in the fabrication of multilayer printed boards GB/T 12629-1990 Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards GB/T 12631-1990 Test method for resistance of conductor of printed boards GB/T 4725-1992 Epoxide woven glass fabric copper-clad laminated sheets for printed circuits GB/T 4724-1992 Epoxide cellulose paper copper-clad laminated sheets for printed circuits