Browse Standards

压电陶瓷振子频率温度稳定性的测试方法

Test method for frequency temperature stability of piezoelectric ceramic vibrator

铁电陶瓷材料电滞回线的准静态测试方法

Quasi-static test method for ferroelectric hysteresis loop of ferroelectric ceramics

固体电介质微波复介电常数的测试方法

Test method for complex permittivity of solid dielectric materials at microwave frequencies

半导体器件 分立器件分规范

Semiconductor devices--Sectional specification for discrete devices

通信设备过电压保护用气体放电管通用技术条件

General technical requirements of gas discharge tubes for the over-voltage protection of telecommunications installations

掩模缺陷检查系统灵敏度分析所用的特制缺陷掩模和评估测量方法准则

Guideline for programmed defect masks and benchmark procedures for sensitivity analysisof mask defect inspection systems

焦深与最佳聚焦的测量规范

Specification for measuring depth of focus and best focus

关键尺寸(CD)计量方法

CD Metrology procedures

标称电压1 kV及以下交流电力系统用非自愈式并联电容器 第3部分:内部熔丝

Shut power capacitor of the non-self-healing type for a.c. systems having arated voltage up to and including 1 kV--Part 3:Internal fuses

标称电压1 kV及以下交流电力系统用非自愈式并联电容器 第1部分:总则----性能、试验和定额----安全要求----安装和运行导则

Shunt power capacitors of the non-self-healing type for a.c.systems having a rated voltage up to and including 1 kV--Part 1:General--Performance，testing and rating--Safety requirements--Guide for installation and operation

标称电压1 kV及以下交流电力系统用非自愈式并联电容器 第2部分:老化试验和破坏试验

Shunt power capacitors of the non-self-healing type for a.c.systems having a rated voltage up to and including 1 kV--Part 2:Ageing test and destruction test

半导体器件 集成电路 第3部分:模拟集成电路

Semiconductor devices--Integrated circuits--Part 3:Analogue integrated circuits

半导体器件 集成电路 第2部分:数字集成电路 第一篇 双极型单片数字集成电路门电路(不包括自由逻辑阵列) 空白详细规范

Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section one--Blank detail specification for bipolar monolithic digital integrated circuit gates(excluding uncommitted logic arrays)

电工、电子设备机械结构术语

Terminology for mechanical structures of electrotechnical and electronic equipment

吸气剂术语

Getter terms

电气元器件的标准数据元素类型和相关分类模式 第2部分: EXPRESS字典模式

Standard data element types with associated classification scheme for electric components--Part 2:EXPRESS dictionary schema

半导体器件 分立器件 第3部分:信号(包括开关)和调整二极管 第1篇 信号二极管、开关二极管和可控雪崩二极管空白详细规范

Semiconductor devices--Discrete devices--Part 3:Signal(including switching) and regulator diodes--Section One--Blank detail specification for signal diodes，switching diodes and controlled-avalanche diodes

预制内层层压板规范(半制成多层印制板)

Specification for mass laminationpanels (semi-manufactured multilayer printed boards)

有贯穿连接的刚挠多层印制板规范

Specification for flex-rigid multilayer printed boards with through connections

有贯穿连接的挠性多层印制板规范

Specification for flexible multilayer printed boards with through conections