GB/T 8446.3-2004
AbolishedHeat sink for power semiconductor device--Part 3:Insulators and fasteners
电力半导体器件用散热器 第3部分:绝缘件和紧固件
📋 Scope / 适用范围 ai_extracted
GB/T 8446的本部分规定了散热器的绝缘件和紧固件的型式系列、尺寸、技术要求、检验规则和包 装、运输等要求。 本部分适用于电力半导体器件用铸造类（包括挤压）散热器的绝缘件和紧固件，也适用于安装尺寸 与铸造散热器相同的型材散热器和热管散热器的绝缘件和紧固件。
📚 References & Relations / 引用与关联
normative_reference
GB/T 1031
normative_reference
GB/T 1031-1995
normative_reference
GB/T 1958
normative_reference
GB/T 2900.
normative_reference
GB/T 4937-1995
normative_reference
GB/T 8446
normative_reference
GB/T 8446.
normative_reference
GB/T 8446.1-2004
normative_reference
GB/T 8446.3
normative_reference
IEC 60749
normative_reference
ISO 468
🔗 Related Standards / 同类标准
GB/Z 107-2025
Semiconductor devices—Scan based ageing level estimation for semiconductor devices
GB/Z 102.17-2026
Semiconductor devices—Discrete devices—Part 17: Magnetic and capacitive coupler for basic and reinforced insulation
GB/T 6256-1986
Blank detail specification forindustrial heating triodes
GB/T 7581-1987
Dimensions of outlines for semiconductor discrete devices
GB/T 9432-1988
Blank detail specification for industrial heating tetrode
GB/T 249-1989
The rule of type designation for discrete semiconductor devices
GB/T 12300-1990
Test methods of safe operating area for power transistors
GB/T 12847-1991
Blank detail specification for hydrogen thyratrons
Content extracted by AI. Not officially verified.