GB/T 19247.3-2003
ActivePrinted board assemblies--Part 3:Sectional specification--Requirements for through-hole mount soldered assemblies
印制板组装 第3部分:分规范 通孔安装焊接组装的要求
📋 Scope / 适用范围 ai_extracted
This section specifies the requirements for soldering assemblies of leads and through-holes. It applies to overall lead and hole assemblies using the through-hole technology (THT) method, as well as to the THT portion of assemblies employing other related methods (i.e., surface mount, chip assembly, termination assembly). 1.2 Classification This section classifies electrical and electronic assemblies based on the intended use of the final product. It is generally divided into three final product classes, which reflect differences in product producibility, complexity, functional requirements, and inspection (examination/testing) frequency. These classes are: Class A: General electronic products Class B: Dedicated electronic products Class C: High-performance electronic products It is the responsibility of the assembly user to determine the class of their product. It should be acknowledged that some equipment may fall under two classes simultaneously. Where applicable, the required class and any exceptions or additional requirements for parameters shall be specified in the contract.
本部分规定了引线与通孔焊接组装的要求。本部分适用于用通孔安装方法(THT)进行整体引线 与孔组装，也适用于采用其他相关方法(即:表面组装、芯片组装、端接组装)组装中的THT部分。 1.2 分类 本部分根据最终产品的用途对电气和电子组装进行分类。通常分为三个最终产品等级，等级反映 产品的可生产性、复杂性、功能要求和检验(检查/测试)频度的差异。这些等级是: A级:普通电子产品 B级:专用电子产品 C级:高性能电子产品 组装使用者有责任确定其产品的等级。应该承认，有些设备可能同属于两个等级。适用时合同中 应规定要求的等级和标明任何对参数的例外或附加要求。
📚 References & Relations / 引用与关联
🔗 Related Standards / 同类标准
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