GB/Z 41275.23-2023

Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies

航空电子过程管理 含无铅焊料航空航天及国防电子系统 第23部分：无铅及混装电子产品返工/修复指南