GB/T 8750-2022

Active

Gold-based bonding wire and bandlet for semiconductor package

半导体封装用金基键合丝、带

Standard Type
GBT
ICS
77.150.99
CCS
H68
Status
现行
Issue Date
2022-12-30
Implementation
2023-07-01
Responsible Dept
中国有色金属工业协会
Drafting Unit
N/A