GB/T 4937.15-2018

Active

Semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices

半导体器件 机械和气候试验方法 第15部分:通孔安装器件的耐焊接热

Standard Type
GBT
ICS
31.080.01
CCS
L40
Status
现行
Issue Date
2018-09-17
Implementation
2019-01-01
Responsible Dept
工业和信息化部(电子)
Drafting Unit
N/A