GB/T 46280.4-2025

Active

Specification for chiplet inerconnection interface—Part 4: Physical layer technical requirements based on 2D package

芯粒互联接口规范 第4部分：基于2D封装的物理层技术要求

Standard Type
GBT
ICS
31.200
CCS
L55
Status
现行
Issue Date
2025-08-19
Implementation
2026-03-01
Responsible Dept
工业和信息化部（电子）
Drafting Unit
N/A