GB/T 44791-2024

Active

Integrated circuit 3D packaging—Requirement for bumping-wafer-thining process and evaluation

集成电路三维封装 带凸点圆片减薄工艺过程和评价要求

Standard Type
GBT
ICS
31.200
CCS
L55
Status
现行
Issue Date
2024-10-26
Implementation
2025-05-01
Responsible Dept
工业和信息化部（电子）
Drafting Unit
N/A