Home / Standards / GB/T 43536.2-2023 GB/T 43536.2-2023 Active Three dimensional integrated circuits—Part 2：Alignment of stacked dies having fine pitch interconnect 三维集成电路 第2部分：微间距叠层芯片的校准要求 Standard Type GBT ICS 31.200 CCS L56 Status 现行 Issue Date 2023-12-28 Implementation 2024-04-01 Responsible Dept 工业和信息化部（电子） Drafting Unit N/A