Home / Standards / GB/T 41853-2022 GB/T 41853-2022 Active Semiconductor devices—Micro-electromechanical devices—Wafer to wafer bonding strength measurement 半导体器件 微机电器件 晶圆间键合强度测量 Standard Type GBT ICS 31.080.99 CCS L55 Status 现行 Issue Date 2022-10-12 Implementation 2022-10-12 Responsible Dept 国家标准委 Drafting Unit N/A