GB/T 41852-2022

Active

Semiconductor devices—Micro-electromechanical devices—Bend-and shear-type test methods of measuring adhesive strength for MEMS structures

半导体器件 微机电器件 MEMS结构黏结强度的弯曲和剪切试验方法

Standard Type
GBT
ICS
31.080.99
CCS
L55
Status
现行
Issue Date
2022-10-12
Implementation
2022-10-12
Responsible Dept
国家标准委
Drafting Unit
N/A