GB/T 34507-2017

Active

Palladium coated copper bonding wire for semiconductor package

封装键合用镀钯铜丝

Standard Type
GBT
ICS
77.150.99
CCS
H68
Status
现行
Issue Date
2017-10-14
Implementation
2018-05-01
Responsible Dept
中国有色金属工业协会
Drafting Unit
N/A