GB/T 15879.604-2023

Active

Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA)

半导体器件的机械标准化第6-4部分：表面安装半导体器件封装外形图绘制的一般规则焊球阵列（BGA）封装的尺寸测量方法

Standard Type

GBT

ICS

31.200

CCS

L55

Status

现行

Issue Date

2023-05-23

Implementation

2023-09-01

Responsible Dept

工业和信息化部（电子）

Drafting Unit

N/A