GB/T 15877-2013

Active

Semiconductor integrated circuits—Specification of DIP leadframes produced by etching

半导体集成电路 蚀刻型双列封装引线框架规范

Standard Type
GBT
ICS
31.200
CCS
L56
Status
现行
Issue Date
2013-12-31
Implementation
2014-08-15
Responsible Dept
工业和信息化部（电子）
Drafting Unit
N/A