Browse Standards

电力系统用串联电容器 第2部分:串联电容器组用保护设备

Series capacitorsfor power systems--Part 2:Protective equipment for series capacitor banks

彩色投影显象管空白详细规范

Blank detail specification for the colour projection picture tubes

彩色投影显象管测试方法

Methods of measurement of the colour projectionpicture tubes

半导体器件 第12-4部分:光电子器件 纤维光学系统或子系统用带/不带尾纤的Pin-FET模块空白详细规范

Semiconductor devices--Part 12-4:Optoelectronicdevices--Blank detail specification for pin-FET modules with/without pigtailfor fiber optic systems or sub-systems

半导体器件 第12-2部分:光电子器件 纤维光学系统或子系统用带尾纤的激光二极管模块空白详细规范

Semiconductor devices--Part 12-2:Optoelectronic devices--Blank detail specification for laser diodes modules with pigtail for fiber optic systems or sub-systems

半导体器件 第12-1部分:光电子器件 纤维光学系统或子系统用带/不带尾纤的光发射或红外发射二极管空白详细规范

Semiconductor devices--Part 12-1:Optoelectronic devices--Blank detail specification for light emitting/infrared emitting diodes with/without pigtail for fiber optic systems or sub-systems

液晶和固态显示器件 第1部分:总规范

Liquid crystal and solid-state display devices--Part 1:Generic specification

微波炉电容器 第1部分:总则

Capacitors for microwave ovens--Part 1:General

直热式阶跃型正温度系数热敏电阻器 第1-3部分:浪涌电流用空白详细规范 评定水平EZ

Thermistors--Directly heated positive step-function temperature coefficient--Part 1-3: Blank detail specification--Inrush current application--Assessment level EZ

直热式阶跃型正温度系数热敏电阻器 第1-2部分:加热元件用空白详细规范 评定水平EZ

Thermistors--Directly heated positive step-function temperature coefficient--Part 1-2: Blank detail specification--Heating element application--Assessment level EZ

半导体器件 第12-5部分:光电子器件 纤维光学系统或子系统用带/不带尾纤的pin光电二极管空白详细规范

Semiconductor devices--Part 12-5: Optoelectronic devices--Blank detail specification for pin-photodiodes with/without pigtail，for fibre optic systems or subsystems

电子设备机械结构 户外机壳 第2-2部分: 箱体尺寸

Mechanical structuresfor electronic equipment--Outdoor enclosures--Part 2-2: Dimensions for cases

电子设备机械结构 户外机壳 第2-1部分:机柜尺寸

Mechanical structuresfor electronic equipment--Outdoor enclosures--Part 2-1:Dimensions for cabinets

电子设备机械结构 户外机壳 第3部分: 机柜和箱体的气候、机械试验及安全要求

Mechanical structures for electronic equipment--Outdoor enclosures--Part 3: Climatic，mechanical tests and safety aspects for cabinets and cases

电子设备机械结构 户外机壳 第2部分: 箱体和机柜的协调尺寸

Mechanical structures for electronic equipment--Outdoor enclosures--Part 2: Coordination dimensions for cases and cabinets

电子设备机械结构 户外机壳 第1部分:设计导则

Mechanical structures for electronic equipment--Outdoor enclosures--Part 1: Design guidelines

电力系统二次回路控制、保护屏及柜基本尺寸系列

Series of basic dimensionof control and protective panels and cabinet for secondary circuit of power system

封装引线电阻测试方法

Test method for measuring the resistance of package leads

印制板组装 第2部分: 分规范 表面安装焊接组装的要求

Printed board assemblies--Part 2: Sectional specification--Requirements for surface mount solderedassemblies

高度进制为20mm的台式机箱基本尺寸系列

Series of basic dimensions of cabiners for vertical increment of 20mm