Browse Standards

电气和电子设备机械结构 公制系列和英制系列的试验 第6部分：户内机柜的安全要求

Mechanical structures for electrical and electronic equipment—Tests for metric and inch system—Part 6: Security aspects for indoor cabinets

电气和电子设备机械结构 符合英制系列和公制系列机柜的热管理 第6部分：户内机柜的空气再循环和旁路

Mechanical structures for electrical and electronic equipment—Thermal management for cabinets in accordance with inch and metric system—Part 6: Air recirculation and bypass of indoor cabinets

半导体器件 柔性可拉伸半导体器件 第9部分：一晶体管一电阻式（1T1R）电阻存储单元性能测试方法

Semiconductor devices—Flexible and stretchable semiconductor devices—Part 9: Performance testing methods of one transistor and one resistor (1T1R) resistive memory cells

半导体器件 人体通信半导体接口 第4部分：胶囊内窥镜

Semiconductor devices—Semiconductor interface for human body communication—Part 4: Capsule endoscope

半导体器件 人体通信半导体接口 第1部分：总则

Semiconductor devices—Semiconductor interface for human body communication—Part 1: General requirements

半导体器件 机械和气候试验方法 第28部分：静电放电（ESD）敏感度测试 带电器件模型（CDM） 器件级

Semiconductor devices—Mechanical and climate test methods—Part 28: Electrostatic discharge (ESD) sensitivity testing—Charged device model (CDM)—device level

半导体器件 柔性可拉伸半导体器件 第8部分：柔性电阻存储器延展性、柔韧性和稳定性测试方法

Semiconductor devices—Flexible and stretchable semiconductor devices—Part 8: Test method for stretchability, flexibility and stability of flexible resistive memory

标称电压1000 V以上交流系统用自愈式并联电力电容器

Shunt power capacitors of the self-healing type for AC systems having a rated voltage above 1 000 V

柔性显示器件 第6-3部分：机械试验方法 撞击和硬度试验

Flexible display devices—Part 6-3: Mechanical test methods—Impact and hardness tests

电子元器件 半导体器件长期贮存 第7部分：微电子机械器件

Electronic components—Long-term storage of electronic semiconductor devices—Part 7：Micro-electromechanical devices

电子元器件 半导体器件长期贮存 第8部分：无源电子器件

Electronic components—Long-term storage of electronic semiconductor devices—Part 8：Passive electronic devices

半导体器件 机械和气候试验方法 第9部分：标志耐久性

Semiconductor devices—Mechanical and climatic test methods—Part 9：Permanence of marking

半导体器件 第5-13部分：光电子器件 LED封装的硫化氢腐蚀试验

Semiconductor devices—Part 5-13:Optoelectronic devices—Hydrogen sulphide corrosion test for LED packages

半导体器件 机械和气候试验方法 第41部分：非易失性存储器可靠性试验方法

Semiconductor devices—Mechanical and climatic test methods—Part 41：Test method for reliability of non-volatile memory devices

单向引出的电容器和电阻器所需空间的测定方法

Method for the determination of the space required by capacitors and resistors with unidirectional terminations

半导体分立器件型号命名方法

Rule of type designation for discrete semiconductor devices

半导体分立器件外形尺寸

Dimensions of outlines for discrete semiconductor devices

半导体分立器件 大功率双极型晶体管空白详细规范

Discrete semiconductor devices—Blank detail specification for high power bipolar transistors

半导体分立器件 小功率双极型晶体管空白详细规范

Discrete semiconductor devices—Blank detail specification for low power bipolar transistors

半导体分立器件 第1部分：分规范

Discrete semiconductor devices—Part 1: Sectional specification