Browse Standards
1450+ standards in database
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激光器和激光相关设备 激光束偏振特性测量方法
Lasers and laser-related equipment—Test methods for laser beam polarization parameters
集成电路电磁兼容建模 第1部分：通用建模框架
EMC IC modelling—Part 1:General modelling framework
集成电路 收发器的EMC评估 第1部分：通用条件和定义
Integrated circuits—EMC evaluation of transceivers—Part 1:General conditions and definitions
系统级封装（SiP）一体化基板通用要求
General requirements for integral substrate of System in Package（SiP）
系统级封装（SiP）术语
Terminology of system in packgae（SiP）
集成电路三维封装 芯片叠层工艺过程和评价要求
Integrated circuit 3D packaging— Requirement for die stack process and evaluation
集成电路三维封装 带凸点圆片减薄工艺过程和评价要求
Integrated circuit 3D packaging—Requirement for bumping-wafer-thining process and evaluation
集成电路三维封装 带凸点圆片划片工艺过程和评价要求
Integrated circuit 3D packaging—Requirement for bumping-wafer-sawing process and evaluation
知识产权（IP）核保护指南
Guideline for intellectual property(IP) core protection
微波电路 限幅器测试方法
Microwave circuits—Measuring methods for limiter
复杂集成电路设计保证指南
Design assurance guidelines for complex integrated circuits
光学和光子学 微透镜阵列 第4部分：几何特性测试方法
Optics and photonics—Microlens arrays—Part 4: Test methods for geometrical properties
光学和光子学 微透镜阵列 第3部分：光学特性测试方法
Optics and photonics—Microlens arrays—Part 3：Test methods for optical properties
微机电系统（MEMS）技术 薄膜力学性能的鼓胀试验方法
Micro-electromechanical systems （MEMS）technology—Bulge test method for measuring mechanical properties of thin films
微电子学微光刻技术术语
Terms of microlithography technology for microelectronics
半导体集成电路 射频发射器/接收器测试方法
Semiconductor integrated circuits—Measuring methods for RF transmitter/receiver
电气和电子设备机械结构 户外机壳 第2部分：协调尺寸
Mechanical structures for electrical and electronic equipment—Outdoor enclosures—Part 2: Coordination dimensions
电气和电子设备机械结构 户外机壳 第3部分：环境要求、试验及安全要求
Mechanical structures for electrical and electronic equipment—Outdoor enclosures—Part 3: Environmental requirements, tests and safety aspects
电气和电子设备机械结构 户外机壳 第1部分：设计导则
Mechanical structures for electrical and electronic equipment—Outdoor enclosures—Part 1: Design guidelines
集成电路 电磁发射测量 第4部分：传导发射测量 1Ω/150Ω直接耦合法
Integrated circuits—Measurement of electromagnetic emissions—Part 4: Measurement of conducted emissions—1Ω/150Ω direct coupling method