Browse Standards

激光产品的安全 第2部分：光纤通信系统（OFCS）的安全

Safety of laser products—Part 2: Safety of optical fibre communication systems (OFCSs)

多层印制板用环氧E玻纤布粘结片

Epoxide woven E-glass prepreg for multilayer printed boards

打印显示 薄膜均匀性测试方法

Print display—Measuring method of film uniformity

激光产品的安全 第1部分：设备分类和要求

Safety of laser products—Part 1: Equipment classification and requirements

微机电系统（MEMS）技术 射频MEMS环行器和隔离器

Micro-electromechanical systems（MEMS）technology—Radio frequency MEMS circulators and isolators

微机电系统（MEMS）技术 MEMS膜残余应力的晶圆曲率和悬臂梁挠度试验方法

Micro-electromechanical systems (MEMS) technology—Wafer curvature and cantilever beam deflection test methods for determining residual stresses of MEMS films

微机电系统（MEMS）技术 传感器用MEMS压电薄膜的环境试验方法

Micro-electromechanical systems (MEMS) technology—Environmental test methods of MEMS piezoelectric thin films for sensor application

微机电系统（MEMS）技术 层状MEMS材料界面黏附能四点弯曲试验方法

Micro-electromechanical systems (MEMS) technology—Four-point bending test method for interfacial adhesion energy of layered MEMS materials

微机电系统（MEMS）技术 MEMS压电薄膜机电转换特性测量方法

Micro-electromechanical systems (MEMS) technology—Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film

微机电系统（MEMS）技术 基于MEMS技术的车规级压力传感器技术规范

Micro-electromechanical systems（MEMS）technology—Technical specification of automotive grade pressure sensor based on MEMS technology

光学晶体 紫外级氟化钙晶体

Optics crystal—Ultraviolet grade calcium fluride crystal

晶片承载器传输并行接口要求

Requirements for wafer carrier handoff parallel I/O interface

激光器和激光相关设备 激光光学元件吸收分布测量 光热成像法

Laser and laser-related equipment—Absorption distribution measurement of optical laser components—Photothermal mapping method

静电放电敏感度试验 传输线脉冲 器件级

Electrostatic discharge sensitivity testing—Transmission line pulse(TLP)—Component level

微机电系统（MEMS）技术 MEMS材料微柱压缩试验方法

Micro-electromechanical systems (MEMS) technology一Micro-pillar compression test for MEMS materials

微机电系统（MEMS）技术 薄膜材料的弯曲试验方法

Micro-electromechanical systems （MEMS） technology—Bend testing methods of thin film materials

微机电系统（MEMS）技术 金属膜材料成形极限测量方法

Micro-electromechanical systems (MEMS) technology—Forming limit measuring method of metallic film materials

集成电路 脉冲抗扰度测量 第2部分: 同步瞬态注入法

Integrated circuits—Measurement of impulse immunity—Part 2: Synchronous transient injection method

集成电路 电磁抗扰度测量 第2部分：辐射抗扰度测量 TEM小室和宽带TEM小室法

Integrated circuits—Measurement of electromagnetic immunity—Part 2: Measurement of radiated immunity—TEM cell and wideband TEM cell method

半导体器件 第16-4部分：微波集成电路 开关

Semiconductor devices—Part 16-4：Microwave intergrated circuits—Switches