Browse Standards
1450+ standards in database
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触摸和交互显示 第12-10部分：触摸显示测试方法 触摸和电性能
Touch and interactive displays—Part 12-10: Measurement methods of touch displays—Touch and electrical performance
触摸和交互显示 第12-20 部分：触摸显示测试方法 多点触摸性能
Touch and interactive displays—Part 12-20: Measurement methods of touch displays—Multi-touch performance
触摸和交互显示 第1-2部分：术语和文字符号
Touch and interactive displays—Part 1-2: Terminology and letter symbols
大规模集成电路（LSI） 封装 印制电路板共通设计结构
Format for LSI—Package—Board interoperable design
显示光源组件 第1-2部分：术语和文字符号
Display lighting unit—Part 1-2: Terminology and letter symbols
4Mb/s数字式时分制指令/响应型多路传输数据总线测试方法
4 Mb/s digital time division command/response multiplex data bus test plan
电子级正硅酸乙酯
Electronic grade ethyl orthosilicate
集成电路封装设备远程运维 状态监测
Remote operation and maintenance of integrated circuit packaging equipment—Status monitoring
室内LED显示屏光舒适度评价要求
Evaluation requirements for visual comfort of indoor LED displays
室内LED显示屏光舒适度评价方法
Evaluation methods for visual comfort of indoor LED displays
红外图像温度表示规则 RGB法
Rules for the representation of infrared image temperature—Method by RGB
透明显示器件 第41部分：测试方法 光学性能
Transparent display devices—Part 41: Measuring methods—Optical performance
宇航用微波集成电路芯片通用规范
General specification for microwave integrated circuit chip for aerospace
电子电气产品中某些物质的测定 第12部分：气相色谱-质谱法同时测定聚合物中的多溴联苯、多溴二苯醚和邻苯二甲酸酯
Determination of certain substances in electrotechnical products—Part 12: Simultaneous determination of polybrominated biphenyls, polybrominated diphenyl ethers and phthalates in polymers by gas chromatography-mass spectrometry
掺钕钇铝石榴石激光棒激光性能测量方法
Test method for lasing capability of Nd:YAG laser rods
氦氖激光器技术规范
Technical specification for He-Ne lasers
激光产品的安全 第5部分：生产者关于GB/T 7247.1的检查清单
Safety of laser products—Part 5:Manufacturer's checklist for GB/T 7247.1
电子电气产品限用物质管理体系 要求
Restricted substances management systems for electrical and electronic products—Requirements
显微物镜数值孔径图像式测量方法
Image measurement method for numerical aperture of microscopic objective
300mm半导体设备装载端口要求
Requirements for load ports of 300mm semiconductor equipment