Browse Standards

宇航用分离脱落连接器通用规范

General specification for separable and break-off connectors for aerospace

半导体器件 功率器件用碳化硅同质外延片缺陷的无损检测识别判据 第3部分：缺陷的光致发光检测方法

Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices—Part 3: Test method for defects using photoluminescence

半导体器件 功率器件用碳化硅同质外延片缺陷的无损检测识别判据 第2部分：缺陷的光学检测方法

Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices—Part 2: Test method for defects using optical inspection

半导体器件 功率器件用碳化硅同质外延片缺陷的无损检测识别判据 第1部分：缺陷分类

Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices—Part 1: Classification of defects

均匀光源通用规范

General specification for uniform light source

龙虾眼型聚焦光学元件性能测试方法

Test method of performance for lobster eye micro pore optics

集成电路知识产权（IP）核设计要求

Design requirements of integrated circuit intellectual property (IP) core

三维集成电路 第2部分：微间距叠层芯片的校准要求

Three dimensional integrated circuits—Part 2：Alignment of stacked dies having fine pitch interconnect

三维集成电路 第1部分：术语和定义

Three dimensional integrated circuit—Part 1：Terminologies and definitions

模拟/混合信号知识产权（IP）核质量评测

Analog/mixed-signal intellectural property(IP)core quality evaluation

模拟/混合信号知识产权（IP）核文档结构指南

Guideline for analog/mix-signal intellectual property(IP) core document structure

模拟/混合信号知识产权（IP）核交付项要求

Requirements for analog/mixed-signal intellectual property(IP) core deliverables

集成电路金属封装外壳质量技术要求

Quality and technical requirements for metal packages used for integrated circuits

激光显示器件 第1-2部分：术语及文字符号

Laser display devices—Part 1-2：Vocabulary and letter symbols

电子气体 一氧化碳

Electronic gas—Carbon monoxide

半导体器件 第5-7部分：光电子器件 光电二极管和光电晶体管

Semiconductor devices—Part 5-7: Optoelectronic devices—Photodiodes and phototransistors

电子设备用固定电容器 第1部分：总规范

Fixed capacitors for use in electronic equipment—Part 1: Generic specification

半导体器件 第5-5部分：光电子器件 光电耦合器

Semiconductor devices—Part 5-5: Optoelectronic devices—Photocouplers

半导体器件 机械和气候试验方法 第35部分：塑封电子元器件的声学显微镜检查

Semiconductor devices—Mechanical and climatic test methods—Part 35: Acoustic microscopy for plastic encapsulated electronic components

半导体器件 机械和气候试验方法 第34部分：功率循环

Semiconductor devices—Mechanical and climatic test methods—Part 34:Power cycling