Browse Standards

1450+ standards in database

1450 result(s) found

GB/T 42709.5-2023 Active

半导体器件 微电子机械器件 第5部分:射频MEMS开关

Semiconductor devices—Micro-electromechanical devices—Part 5: RF MEMS switches

ICS: 31.200
2023-09-01
GB/T 42576-2023 Active

北斗/全球卫星导航系统(GNSS)高精度片上系统(SoC)技术要求及测试方法

Technical requirements and testing methods of BDS/GNSS high precision system on chip (SoC)

ICS: 31.190
2023-12-01
GB/T 26111-2023 Active

微机电系统(MEMS)技术 术语

Micro-electromechanical system technology—Terms

ICS: 31.080.99
2023-09-01
GB/T 42191-2023 Active

MEMS压阻式压力敏感器件性能试验方法

Test methods of the performances for MEMS piezoresistive pressure-sensitive device

ICS: 31.080.99
2023-09-01
GB/T 4937.23-2023 Active

半导体器件 机械和气候试验方法 第23部分:高温工作寿命

Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life

ICS: 31.080.01
2023-12-01
GB/T 4937.42-2023 Active

半导体器件 机械和气候试验方法 第42部分:温湿度贮存

Semiconductor devices—Mechanical and climatic test methods—Part 42:Temperature and humidity storage

ICS: 31.080.01
2023-12-01
GB/T 27700.1-2023 Active

有质量评定的声表面波滤波器 第1部分 :总规范

Surface acoustic wave (SAW) filters of assessed quality—Part 1:Generic specification

ICS: 31.140
2023-12-01
GB/T 42744-2023 Active

微波电路 电调衰减器测试方法

Microwave circuit—Measuring methods for electrically controlled attenuator

ICS: 31.200
2024-03-01
GB/T 42837-2023 Active

微波半导体集成电路 放大器

Microwave semiconductor integrated circuits—Amplifier

ICS: 31.200
2023-12-01
GB/T 42836-2023 Active

微波半导体集成电路 混频器

Microwave semiconductor integrated circuits—Frequency mixer

ICS: 31.200
2023-12-01
GB/T 42839-2023 Active

半导体集成电路 模拟数字(AD)转换器

Semiconductor integrated circuits—Analog digital(AD) converter

ICS: 31.200
2023-12-01
GB/T 42835-2023 Active

半导体集成电路 片上系统(SoC)

Semiconductor integrated circuits—System on chip(SoC)

ICS: 31.200
2023-12-01
GB/T 42838-2023 Active

半导体集成电路 霍尔电路测试方法

Semiconductor integrated circuits—Measuring method of Holzer circuit

ICS: 31.200
2023-12-01
GB/T 12274.401-2023 Active

有质量评定的石英晶体振荡器 第4-1部分:空白详细规范 能力批准

Quartz crystal controlled oscillators of assessed quality—Part 4-1: Blank detail specification—Capability approval

ICS: 31.140
2023-12-01
GB/T 42709.19-2023 Active

半导体器件 微电子机械器件 第19部分:电子罗盘

Semiconductor devices—Micro-electromechanical devices—Part 19: Electronic compasses

ICS: 31.200
2024-03-01
GB/T 42848-2023 Active

半导体集成电路 直接数字频率合成器测试方法

Semiconductor intergrated circuits—Test method of direct digital frequency synthesizer

ICS: 31.200
2023-12-01
GB/T 42895-2023 Active

微机电系统(MEMS)技术 硅基MEMS微结构弯曲强度试验方法

Micro-electromechanical systems(MEMS)technology—Bending strength test method for microstructures of silicon based MEMS

ICS: 31.200
2023-12-01
GB/T 42897-2023 Active

微机电系统(MEMS)技术 硅基MEMS纳米厚度膜抗拉强度试验方法

Micro-electromechanical systems(MEMS) technology—Tensile strength test method for nano-scale membranes of silicon based MEMS

ICS: 31.200
2023-12-01
GB/T 42896-2023 Active

微机电系统(MEMS)技术 硅基MEMS纳尺度结构冲击试验方法

Micro-electromechanical systems(MEMS) technology—Impact test method for nanostructures of silicon based MEMS

ICS: 31.200
2023-12-01
GB/T 4587-2023 Active

半导体器件 分立器件 第7部分:双极型晶体管

Semiconductor devices—Discrete devices—Part 7:Bipolar transistors

ICS: 31.080.30
2024-04-01
Previous Page 50 of 73 Next