Browse Standards

钨铼合金丝

Tungsten-rhenium alloy wires

集成电路用全自动装片机

Integrated circuit full automatic die bonder

光伏组件封装材料加速老化试验方法

Method for accelerated aging test of PV module encapsulating material

视觉模组光电性能的图像式检测方法

Image-based test method for vision module photoelectric performance

耦合电容器及电容分压器 第3部分：用于谐波滤波器的交流或直流耦合电容器

Coupling capacitors and capacitor dividers—Part 3: AC or DC coupling capacitor for harmonic-filters applications

耦合电容器及电容分压器 第2部分：接于线与地之间用于电力线路载波（PLC）的直流或交流单相耦合电容器

Coupling capacitors and capacitor dividers—Part 2: DC or AC single-phase coupling capacitor connected between line and ground for power line carrier-frequency (PLC) application

可穿戴设备的光辐射安全要求

Optical radiation safety requirements of wearable devices

电力半导体器件用散热器 第2部分：热阻和流阻测量方法

Heat sinks for power semiconductor devices—Part 2: Measurement methods of thermal resistance and inlet-outlet fluid pressure drop

印制电路用覆铜箔环氧玻纤布层压板

Epoxide woven glass fabric copper-clad laminated sheets for printed circuits

激光器和激光相关设备 激光装置 文件基本要求

Lasers and laser-related equipment—Laser device—Minimum requirements for documentation

脉冲激光时域主要参数测量方法

Measurement methods for main parameters of pulsed laser in time-domain

光学和光子学 微透镜阵列 第1部分：术语

Optics and photonics—Microlens array—Part 1:Vocabulary

高功率激光制造设备安全和使用指南

Guidance and safety requirements for high power laser manufacturing equipments

半导体器件 微机电器件 MEMS结构黏结强度的弯曲和剪切试验方法

Semiconductor devices—Micro-electromechanical devices—Bend-and shear-type test methods of measuring adhesive strength for MEMS structures

半导体器件 微机电器件 晶圆间键合强度测量

Semiconductor devices—Micro-electromechanical devices—Wafer to wafer bonding strength measurement

光学和光子学 微透镜阵列 第2部分：波前像差的测试方法

Optics and photonics—Microlens array—Part 2:Test methods for wavefront aberrations

电子设备机械结构 公制系列和英制系列的试验 第5部分：机箱、插箱和插件的地震试验

Mechanical structures for electronic equipment—Tests for metric and inch system—Part 5: Seismic tests for chassis, subracks and plug-in units

电子设备机械结构　公制系列和英制系列的试验　第4部分：模数机柜的性能等级组合

Mechanical structures for electronic equipment—Tests for metric and inch system—Part 4: Combination of performance levels for modular cabinets

电气和电子设备机械结构　符合英制系列和公制系列机柜的热管理　第5部分：户内机柜的冷却性能评估

Mechanical structures for electrical and electronic equipment—Thermal management for cabinets in accordance with inch and metric system—Part 5: Cooling performance evaluation for indoor cabinets

铬铒共掺钇钪镓石榴石晶体光学及激光性能测量方法

Method for measuring optical and laser performance for Chromium and Erbium co-doped Yttrium Scandium Gallium Garnet laser crystal