Browse Standards

激光指示器产品光辐射安全要求

Safety requirements of optical radiation for laser pointers products

电子设备机械结构 482.6 mm（19 in）系列机械结构尺寸 第3-107部分：小型化插箱和插件的尺寸

Mechanical structures for electronic equipment—Dimensions of mechanical structures of the 482.6 mm (19 in) series—Part 3-107: Dimensions of subracks and plug-in units, small form factor

电子设备机械结构　公制系列和英制系列的试验　第3部分：机柜和插箱的电磁屏蔽性能试验

Mechanical structures for electronic equipment—Tests for metric and inch system—Part 3: Electromagnetic shielding performance tests for cabinets and subracks

宇航电子产品 印制电路板总规范

Aerospace electronic products—General specification for printed circuit board

宇航用电连接器设计准则和方法

Design rules and methods for areospace electrical connectors

宇航用高速传输连接器通用规范

General specification for high speed transmission connectors for aerospace

电子电气产品中某些物质的测定 第1部分：介绍和概述

Determination of certain substances in electrical and electronic products—Part 1: Introduction and overview

电子电气产品中某些物质的测定 第7-1部分：六价铬 比色法测定金属上无色和有色防腐镀层中的六价铬[Cr(VI)]

Determination of certain substances in electrical and electronic products—Part 7-1:Hexavalent chromium—Presence of hexavalent chromium [Cr(VI)] in colourless and coloured corrosion-protected coatings on metals by the colorimetric method

电子电气产品中某些物质的测定 第2部分：拆解、拆分和机械制样

Determination of certain substances in electrical and electronic products—Part 2: Disassembly，disjointment and mechanical sample preparation

电子电气产品中某些物质的测定 第3-1部分：X射线荧光光谱法筛选铅、汞、镉、总铬和总溴

Determination of certain substances in electrical and electronic products—Part 3-1: Screening lead, mercury, cadmium, total chromium and total bromine by X-ray fluorescence spectrometry

电子电气产品中某些物质的测定 第6部分：气相色谱-质谱仪（GC-MS）测定聚合物中的多溴联苯和多溴二苯醚

Determination of certain substances in electrical and electronic products—Part 6: Polybrominated biphenyls and polybrominated diphenyl ethers in polymers by gas chromatography-mass spectrometry（GC-MS）

覆铜板用氧化铝陶瓷基片

Alumina ceramic substrate for copper clad laminate

集成电路（IC）卡封装框架

Itegrated circuit (IC)card packaging framework

半导体发光二极管光辐射安全 第2部分：测试方法

Optical radiation safety of LEDs—Part 2: Measurement methods

半导体发光二极管光辐射安全 第1部分：要求与等级分类方法

Optical radiation safety of LEDs—Part 1: Safety requirements and classification

半导体集成电路外形尺寸

Outline dimensions of semiconductor integrated circuits

电子设备用机电元件 基本试验规程及测量方法 第25-7部分：试验25g：阻抗、反射系数和电压驻波比（VSWR）

Electromechanical components for electronic equipment—Basic testing procedures and measuring methods—Part 25-7: Test 25g: Impedance, reflection coefficient, and voltage standing wave ratio (VSWR)

电子设备用机电元件 基本试验规程及测量方法 第25-5部分：试验25e：回波损耗

Electromechanical components for electronic equipment—Basic testing procedures and measuring methods—Part 25-5：Test 25e: Return loss

电子设备用机电元件 基本试验规程及测量方法 第25-4部分：试验25d：传输时延

Electromechanical components for electronic equipment—Basic testing procedures and measuring methods—Part 25-4: Test 25d: Propagation delay

电子设备用机电元件 基本试验规程及测量方法 第25-3部分：试验25c：上升时间衰减

Electromechanical components for electronic equipment—Basic testing procedures and measuring methods—Part 25-3: Test 25c: Rise time degradation