Browse Standards

半导体集成电路电压/频率和频率/电压转换器测试方法的基本原理

General principles of measuring methods of V/F and F/V converters for semiconductor integrated circuits

半导体集成电路封装术语

Terminology of packages for semiconductor inte-grated circuits

半导体集成电路 塑料双列封装冲制型引线框架规范

Semiconductor integrated circuits--Specification for stamped leadframes of plastic DIP

单孔轴套安装、轴控电子元件的安装尺寸

Dimensions for the mounting of single-hole， bush-mounted， spendle-operated electronic components

半导体集成电路外形尺寸

Outline dimensions of semiconductor integratedcircuits

闸流管与充气整流管空白详细规范 (可供认证用)

Blank detail specificationfor thyratorns and gas-filled rectifier tubes

闸流管与充气整流管总规范 (可供认证用)

General specification for thyratrons and gas-filled rectifier tubes

显示管防眩玻屏技术要求及试验方法

Technical requirement and test methodfor the non-glare display glass tube

半导体集成电路TTL电路系列和品种 PAL系列的品种

Series and productsfor TTL semiconductor integrated circuits--Products of series PAL

掺铷钇铝石榴石激光棒尺寸系列

Dimension series for neodymium-doped yttrium aluminium garnet laser rods

充气稳压管总规范(可供认证用)

Generic specification for gas-filled voltage stabilizing tubes

变像管和像增强管空白详细规范(可供认证用)

Blank detail specification for image-converter tubes and image intensifier tubes

变像管和像增强管总规范(可供认证用)

Generic specification for image-converter tubes and image intensifier tubes

变像管和像增强管测试方法

The methods of measurement for image-converter tubes and image intensifier tubes

手控电子元件的轴端尺寸

Dimensions of spendle ends for manually operated electronic components

电子设备热设计术语

Terms for thermal design of electronic equipment

无贯穿连接的单、双面挠性印制板技术条件

Specification for single and double sided flexible printed boards without through connections

有贯穿连接的单、双面挠性印制板技术条件

Specification for single and double sided flexible printed boards with through connections

挠性印制电路用涂胶聚酰亚胺薄膜

Adhesive coated polyimide film for flexible printed circuits

挠性印制电路用涂胶聚酯薄膜

Adhesive coated polyester film for flexibleprinted circuits